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Theses/Dissertations
Author Arjun, Anup, 1980-

Title Mechanical integrity of thin films / by Anup Arjun.

Published ©2004.
LOCATION CALL # STATUS
 MST DEPOSITORY  THESIS T 8649/8668  MICROFILM    NOT CHECKED OUT
 MST Thesis  THESIS T 8662    NOT CHECKED OUT
Description ix, 63 leaves : illustrations ; 28 cm.
Summary "The mechanical integrity of thin films is characterized by the adhesion between solid bodies and membranes. Two methods to evaluate the strain energy release rates of thin film delamination are discussed. This strain energy release rate is useful to the experimentalists in their measurements of adhesion or delamination energy of thin films having wide ranging thickness and stiffness. This thesis is primarily concerned with the pressurized blister test and a novel circular punch loaded technique"--Abstract, leaf iii.
Notes Vita.
Includes bibliographical references (leaves 58-62).
M.S. University of Missouri--Rolla 2004.
Subjects Thin films -- Analysis.
Adhesion.
Other Titles MST thesis. Mechanical Engineering (M.S., 2004).
Additional Keywords Delamination.
Strain energy release rate.
OCLC/WorldCat Number 62267703
Author Arjun, Anup, 1980-
Title Mechanical integrity of thin films / by Anup Arjun.
Subjects Thin films -- Analysis.
Adhesion.
Additional Keywords Delamination.
Strain energy release rate.
Other Titles MST thesis. Mechanical Engineering (M.S., 2004).
Permanent Link
http://merlin.lib.umsystem.edu:80/record=b5395225~S5