| Description |
x, 39 leaves : illustrations ; 28 cm. |
| Summary |
"With growing concerns over environmental issues and recent legislation, the use of tin-lead solders is being rapidly replaced by lead-free (LF) solders. The rapid replacement of the tin-lead solders with lead-free solders has raised issues, particularly in the aerospace and defense industries, over the maintainability and repairability of electronic assemblies. Due to the long life cycle of these aerospace vehicles, repair and maintenance of electronic assemblies are critical in ensuring proper operation. An area that has lacked significant attention is repair, particularly hand repair using LF solders. This can result in a mixture of tin-lead (SnPb) and LF solders of various composition. In this study, SnPb, LF, and mixed solder joints were analyzed following thermally cycling and aging at 150⁰C to examine the composition and environmental effects on solder joints"--Abstract, leaf iv. |
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