| Description |
x, 156 leaves : illustrations ; 29 cm |
| Summary |
"Accurate characterization of laminate dielectrics as substrates of printed circuit boards (PCB) over a wide frequency range (from tens megahertz to tens gigahertz) is important from a signal integrity (SI) point of view. Accurate knowledge of dielectric constants (DK) and dissipation factors (DF), or loss tangents, of laminate dielectrics, as well as loss in conductors, as functions of frequency over a wide frequency range, are needed to the designers of high-speed digital electronics. An "in situ" wideband traveling-wave technique based on measuring S-parameters of the PCB test vehicles with auxiliary "through-reflect-line" (TRL) calibration patterns has been developed. This technique has been extensively applied to the material characterization of PCBs up to 20 GHz. However, extension of the frequency range of testing PCBs up to 50 GHz requires solving numerous problems, related to a new PCB test vehicle design and improvement of the material parameter extraction algorithms to take into account various subtle effects arising as frequencies increase to 50 GHz. Extending the frequency range in the new 50-GHz test vehicles leads to potentially increasing uncertainties compared to the 20-GHz test vehicles. Different sources of errors and uncertainties for extracting DK and DF values are analyzed for both the present 20-GHz and the new perspective 50-GHz test vehicles. The limitations for the design of test vehicles are also discussed. An alternative technique for measuring dielectric parameters of PCB laminate dielectrics is using split-post dielectric resonator (SPDR). This narrowband technique is applied to measurements of thin dielectric plates at frequencies 10 GHz, 15 GHz, and 20 GHz"--Abstract, leaf iii. |
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